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Automotive storage solutions

The era of Internet of Vehicles (IoV) continues to drive the automotive industry evolution forward and vehicles are becoming more connected. ATP’s automotive solutions deliver the quality and reliability assurance to meet the requirements of major automotive OEM/Tier 1 suppliers, system developers and service providers for higher levels of data accuracy, consistency and integrity in applications such as maps/navigation systems, in-vehicle infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and other data- intensive applications. These solutions can withstand extreme temperatures, dust and shock/vibration, and maintain data integrity under power cycling or sudden power-off events.

Leveraging over 25 years of manufacturing experience and 8 years of automotive experience, ATP uses its vast knowledge base to analyze and simulate usage cases according to customized test criteria with specific software and test scripts. This enables ATP to tailor-fit products and adapt to customer-specific requirements. Under the Joint Validation program, compatibility and functional tests are conducted with customers’ host devices and systems. At mass production stage, 100%  production level burn-in test using wide temperature ranges sorts out manufacturing or component defects before shipping to customers.

Quality Capabilities

Engineering Capabilities

•VDA 6.3/APQP/ASPICE*
•Certifications: ISO9001, ISO14001, ISO/TS16949**
•Product Validation: PPAP*
•IMDS (International-Material-Data-System)
•Continuous improvement — 8D reports and failure analysis
* Available on a project basis.
**On select models
•ATP IVI Test Plan
•Selected AEC-Q100 test items and conditions approved by customers
•Power Cycling test: ATP unique F/W and testing script
•ATP NAND flash IC-level test (Data Retention, Endurance,Read Disturbance)
•Joint Validation: compatibility and function tests with IVI systems

 

  

Product Line

Automotive

Product Name

SD/SDHC/SDXC

microSD/microSDHC/microSDXC

Naming

S600a

Flash Type

iTemp MLC

MLC

iTemp MLC

MLC

Density

8 GB* to 64 GB

8 GB* to 32 GB

Performance

Sequential Read up to (MB/s)

95

95

Sequential Write up to (MB/s)

79

79

Interface

8 GB ~ 64 GB, UHS-I

8 GB ~ 64 GB, UHS-I

Operating Temperature

-40°C to 85°C

-25°C to 85°C

-40°C to 85°C

-25°C to 85°C

 

Reliability

TBW** (max.)

76.8 TB

38 TB

MTBF @ 25°C

>2,000,000 hours

>2,000,000 hours

Number of Insertions:

20,000 (SDA spec minimum 10,000)

Dimensions: L x W x H (mm)

32.0 x 24.0 x 2.1

15.0 x 11.0 x 1.0

 

*By project support. **Under highest Sequential write value. May vary by density, configuration and applications.

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  • System Integrator
  • OEM
  • Manufacture
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