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ATPs DRAM-Module für Netzwerk- und Embedded-Applikationen werden
durch spezielle Next Generation TDBI- und TE-Verfahren getestet und
bieten eine erhöhte Flexibilität, Effizienz und Skalierbarkeit.


ATPs industrielle Flash-Produkte werden speziell für einen dauerhaften
Einsatz unter schwierigsten Bedingungen, wie extremen Temperaturen,
Stößen, Vibrationen und Feuchtigkeit, entwickelt.


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